Company

Microtech Global LtdSee more

addressAddressGermany
type Form of workPermanent, full-time
salary Salary£99,000 - £100,000 per annum
CategoryConstruction & Property

Job description

Responsibilities:

  • Perform 3D electromagnetic simulations of novel package concepts and give guidelines on package optimization based on three main aspects (mechanical, thermal and electrical), together with package experts
  • Support Application board design and optimization for novel device concepts and for advanced application testing
  • Play an active role in the Virtual Prototype System-Level Approach Development. Within the field of Package/Board optimization and act as interface between the device technology group and the application engineering group
  • Benchmark with measurements and interface with application engineers and validate application simulations with measurements

To be considered for this position you will need the following:

  • Master or PhD Degree in Electrical Engineering, Physics or any other related disciplines
  • Profound work experience in the field of Electromagnetic Modeling, Semiconductor Device Physics
  • Experience in the semiconductor industrial environment
  • Experienced with Electromagnetic Simulation Tools, like Ansys Q3D, Comso
Refer code: 3450514. Microtech Global Ltd - The previous day - 2024-06-25 10:55

Microtech Global Ltd

Germany

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