Responsibilities:
- Perform 3D electromagnetic simulations of novel package concepts and give guidelines on package optimization based on three main aspects (mechanical, thermal and electrical), together with package experts
- Support Application board design and optimization for novel device concepts and for advanced application testing
- Play an active role in the Virtual Prototype System-Level Approach Development. Within the field of Package/Board optimization and act as interface between the device technology group and the application engineering group
- Benchmark with measurements and interface with application engineers and validate application simulations with measurements
To be considered for this position you will need the following:
- Master or PhD Degree in Electrical Engineering, Physics or any other related disciplines
- Profound work experience in the field of Electromagnetic Modeling, Semiconductor Device Physics
- Experience in the semiconductor industrial environment
- Experienced with Electromagnetic Simulation Tools, like Ansys Q3D, Comso